From lab to fab - progress and challenges for industrialization of new lithography technologies
Eric Meurice, CEO, ASML
The semiconductor industry has kept Moore's law alive, albeit at the cost of complexity and shrinking tolerances. Often the path to the solution that best fits a chip manufacturer's needs is not immediately obvious. As an industry leader in lithography equipment, ASML provides crucial support for the semiconductor shrink roadmap.
ASML continues to develop immersion lithography scanners to support cost-effective double patterning and even quadruple patterning, supported by an expanding portfolio of holistic lithography products that can predict and adjust for shrinking tolerances. At the same time, EUV lithography has become a reality with six second-generation EUV systems exposing wafers at customer manufacturing sites. Offering single exposure shrink and many other advantages over more complex technologies, EUV is in the process of becoming a stable, high-productivity lithography platform for the next decade of shrink, offering several more benefits for the early adopters.
This presentation connects the crossroads faced by today's pluriform chip manufacturing industry and ASML's commitment to help the industry continue Moore's law.
Eric Meurice joined ASML on October 1, 2004 as president, chief executive officer and chairman of the board of management. Prior to joining ASML, and since March 2001, he was executive vice president of Thomson Television Worldwide. Between 1995 and 2001, he served as vice president for Dell Computer, where he ran the Western, Eastern Europe and Dellís Emerging Markets businesses within Emea. Before 1995 he gained extensive experience in the semiconductor industry at ITT Semiconductors Group and Intel, in the microcontroller group. Meurice has earned a masterís degree in applied economics (1979), Sorbonne University, Paris, a masterís degree in mechanics and energy generation (1979), Ecole Centrale de Paris, and an MBA (1984), Stanford University, California.